- 引脚图
- 焊盘图
温馨提醒：图片仅供参考，商品以实物为准
XV16M00000S412
商品参数
参数完善中
商品特性
- 贴片晶体，缝焊封装，尺寸2.0mmx1.6mmx0.5mm，4引脚
- 低成本、高精度、高频率稳定性
- 符合RoHS/RoHS III标准
应用领域
-蓝牙、无线通信设备-通信电子设备
- XV24M00000S406
- XV24M00000S409
- XV24M00000S412
- XV25M00000S412
- XV25M00000S420
- XV26M00000S409
- XV27M12000S410
- XV32M00000S409
- XV48M00000S411
- XY24M00000S408
- XY25M00000S412
- XY25M00000S418
- XY26M00000S412
- XY27M12000S408
- XY32M00000S412
- XY36M00000S416
- MS27472T18B66S(LC)
- MS27472T18B66SA(LC)
- MS27472T18B66SB(LC)
- MS27472T18B66SC(LC)
- MS27472T18B66SD(LC)