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TPD1E10B06QDPYRQ1实物图
  • TPD1E10B06QDPYRQ1商品缩略图
  • TPD1E10B06QDPYRQ1商品缩略图
  • TPD1E10B06QDPYRQ1商品缩略图

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TPD1E10B06QDPYRQ1

双向 5.5V 9A@8/20us

SMT扩展库SMT补贴嘉立创PCB免费打样
私有库下单最高享92折
描述
TPD1E10B06-Q1 采用 0402 封装的汽车类 12pF、±5.5V、±30kV ESD 保护二极管
品牌名称
TI(德州仪器)
商品型号
TPD1E10B06QDPYRQ1
商品编号
C1847696
商品封装
X1-SON-2(0.6x1)​
包装方式
编带
商品毛重
0.007克(g)

商品参数

属性参数值
商品目录静电和浪涌保护(TVS/ESD)
极性双向
反向截止电压(Vrwm)5.5V
钳位电压14V
峰值脉冲电流(Ipp)9A@8/20us
峰值脉冲功率(Ppp)90W@8/20us
击穿电压6V;9V
属性参数值
反向电流(Ir)100nA
通道数单路
工作温度-40℃~+125℃
防护等级IEC 61000-4-2
类型ESD
Cj-结电容12pF

商品概述

The TPD1E10B06-Q1 device is a bidirectional TVS ESD protection diode that offers a small 0402 package suitable for space-constrained applications and the industry-standard leaded SOD-523 package to support automated optical inspection (AOI). The TPD1E10B06-Q1 is rated for ESD shock dissipation higher than the maximum level specified by the IEC 61000-4-2 Level 4 international standard and can easily reach 5000V. Low dynamic resistance and low clamping voltage ensure system-level transient event protection, providing adequate protection for designs exposed to ESD events. The device also features 12pF I/O capacitance, making it ideal for audio lines, buttons, memory interfaces, or GPIOs. There is also a non-automotive qualified version of this device: TPD1E10B06.

商品特性

  • Compliant with AEC-Q101 standard
  • IEC61000-4-2 Level 4 ESD protection
    • ±30kV contact discharge
    • ±30kV air-gap discharge
  • ISO 10605 (330pF, 330Ω) ESD protection
    • ±8kV contact discharge (DPY)
    • ±15kV air-gap discharge (DPY)
    • ±25kV contact discharge (DYA)
    • ±25kV air-gap discharge (DYA)
  • IEC61000-4-5 surge protection
    • 6A (8μs/20μs)
  • I/O capacitance: 12pF (typical)
  • RDYN: 0.38Ω (typical)
  • DC breakdown voltage: ±6V (minimum)
  • Ultra-low leakage current: 100nA (maximum)
  • Clamping voltage at 10V (typical at IPP = 1A)
  • Industrial temperature range: -40°C to +125°C
  • Space-saving 0402 form factor
  • Industry-standard leaded SOD-523 package (1.6mm×0.8mm×0.65mm)

应用领域

  • End equipment:
    • Audio head units
    • High-end audio systems
    • External amplifiers
    • Body control modules
    • Gateways
    • Telematics systems
    • Camera modules
  • Interfaces:
    • Audio lines
    • Buttons
    • Memory interfaces
    • GPIOs