- 商品参数
- 商品详情
- 规格书
商品参数
参数完善中
商品详情
产品特点 FEATURES
Specialized surface mount heat sink for D2PAK (TO-263) package semiconductors
Indirect heat dissipation design: no direct contact with the device like traditional through-hole heat sinks
Thermal transfer mechanism: device and heat sink are soldered to a modified drain pad, forming a path from package tab to heat sink
Material specification: 0.63mm (0.025 inches) thick copper for excellent thermal conductivity
Surface finish: tin-plated to enhance solderability and corrosion resistance
Packaging options: 13-inch reel (250 units per reel) for automated SMT assembly, or bulk (500 units per bag) for manual operations
使用场景 APPLICATIONS
Cooling power semiconductors in switch-mode power supplies (SMPS)
Thermal management for motor control circuit components (e.g., MOSFETs in D2PAK packages)
LED driver modules requiring efficient heat dissipation
Automotive electronics systems (e.g., power management units in ECUs)
Industrial control equipment (PLCs, inverters) with D2PAK package semiconductors
Consumer electronics like audio amplifiers, TV power boards, and gaming console power supplies
Renewable energy systems (solar inverters) using D2PAK package components
注意事项 PRECAUTIONS
Ensure the PCB's modified drain pad follows the recommended footprint (refer to Figure A and B on page 26 of the specification for exact dimensions)
Adhere to standard SMT soldering parameters (temperature, time) to achieve a strong, low-resistance thermal joint
Choose the appropriate packaging: reel for pick-and-place machines, bulk for manual soldering
Avoid applying excessive mechanical stress during installation or rework to prevent damage to the heat sink, PCB, or semiconductor device
Verify that the heat sink dimensions are compatible with the target D2PAK (TO-263) package and surrounding PCB components
Store the heat sink in a dry, clean environment to maintain the tin-plated finish's solderability
573300D00010G
价格：￥6
购买数量
个
(250个/圆盘，最小起订量1个，递增量：1)
总价金额：
￥0.00精选推荐
其他推荐