1 Input voltage:240-330VDC, output voltage:30-41.25VDC, rated power:235W

2 Compliant with MIL-STD-704E/F standards

3 High efficiency: up to95.4% (ambient) and94.7% (100°C case temp)

4 High power density: >796W/in³

5 Built-in protections: undervoltage lockout, overvoltage lockout, overcurrent, short circuit, overtemperature

6 Support enable/disable control (PC pin) and temperature monitoring (TM pin)

7 Parallelable for multi-kW power arrays

8 Compact size: ~32.5×22.0×6.73mm, weight:14g

9 Surface mount J-lead package compatible with standard assembly processes

1 High-density power supply systems

2 Communication equipment power modules

3 Distributed power systems with high-voltage input

4 Scalable power solutions for industrial applications

5 Compact power systems requiring high efficiency and reliability

1 Operating temperature range: -55°C to125°C; keep case temp below100°C for safe operation

2 Input voltage must be within240-330VDC; avoid overvoltage transients

3 Output power should not exceed235W continuously; transient peak power up to352.5W (≤5ms)

4 PC pin: pull below1.95V to disable, above2V to enable

5 TM pin: temperature monitoring accuracy±5°C, can act as power good flag

6 Parallel modules need symmetric PCB layout and common copper planes

7 Recommended fuses: ≤2.5A Bussmann PC-Tron or ≤3.15A SOC type36CFA

8 Avoid continuous reverse power operation; transient reverse (<10ms,10% duty cycle) allowed

9 Soldering: max reflow temp245°C, time above183°C≤150s

10 Maintain low source impedance at input for optimal dynamic response

MBCM270F338M235A00-PDF数据手册-参考资料