产品特点 FEATURES

Compact half-brick size, conforming to telecommunication market standard

1 High efficiency up to 88% (typical at rated input/output)

2 High reliability: no built-in aluminum or tantalum electrolytic capacitors

3 Built-in protection circuits: overcurrent (triggers at >105% of rated load, auto-recovers), overvoltage (13.8-16.8V range), and thermal protection

4 Supports remote ON/OFF control (negative logic: L=ON, H=OFF) and remote sensing function

5 Conduction cooling design via aluminum base plate

6 Dimensions: 57.9×12.7×61.0mm (W×H×D), maximum weight 83g

7 Safety certifications: UL60950-1, C-UL, EN62368-1; compliant with CE, UKCA, RoHS directives

8 Isolation performance: input-output DC1500V/AC1000V (1 minute), input-case DC1500V/AC1000V (1 minute), output-case AC500V (1 minute)

9 Environmental resistance: operating temperature -40 to +100°C, vibration resistance (10-55Hz, 5G), impact resistance (20G), maximum operating altitude 3000m

10 5-year warranty for long-term reliability

使用场景 APPLICATIONS

Telecommunication equipment (base stations, routers, switches) requiring stable DC power conversion

1 Industrial automation systems (PLCs, motor drives, sensors) needing efficient power management

2 Network devices and embedded systems with DC36-76V input and DC12V output requirements

3 High-reliability applications (medical instruments, test equipment) where electrolytic capacitor failure risks are to be minimized

4 Systems requiring remote power control (ON/OFF) and voltage sensing functions

5 Conduction-cooled environments (enclosed cabinets, space-constrained setups)

注意事项 PRECAUTIONS

Must use conduction cooling (e.g., attach heat sink to aluminum base plate); refer to derating curves for load adjustment based on base plate temperature

1 Avoid routing DC input/output patterns under the module to reduce conducted/output noise

2 Apply a copper shield pattern on the PCB connected to the case pin or mounting hole to reduce high-frequency radiated noise

3 Do not apply excessive stress to input/output pins; avoid bending/pulling pins with force

4 Soldering guidelines: flow soldering at ≤260°C for ≤15s; soldering iron (26W) at ≤450°C for ≤5s

5 Fix the module with screws (mounting hole torque ≤0.49N·m) before soldering pins to prevent PCB pattern damage

6 Read the official instruction manual and "Before using our product" document before operation

7 Minimize temperature fluctuation range to extend thermal fatigue life during power cycles

8 Operation within hatched areas of derating curves may cause high ripple/noise; contact Cosel for detailed cooling advice

CBS2004812-RF6-PDF数据手册-参考资料