产品特点 FEATURES

1 Compact half-brick form factor, compliant with telecommunication market standard size

2 High efficiency: 83% typical at rated input (DC24V) and rated load (5V 20A)

3 High reliability: No built-in aluminum or tantalum electrolytic capacitors

4 Built-in protection circuits: Overcurrent (auto-recover above 105% rating), overvoltage (5.75~7.00V range), thermal protection

5 Built-in remote ON/OFF function (negative logic: L=ON, H=OFF)

6 Equipped with M3 tapped mounting holes for easy installation

7 Multiple certifications: CE marking, UKCA marking, UL60950-1 approval, C-UL recognition, TUV approval

8 5-year warranty for long-term use assurance

9 Isolated design and low profile

10 Conduction cooling via aluminum base plate (heat dissipation to attached heat sink)

11 Input voltage range: DC18~36V

12 Output specifications: 5V DC, 20A (100W max); line regulation ≤10mV max, load regulation ≤10mV max

13 Ripple and noise control: ≤80mVp-p (at -20~+100°C), ≤120mVp-p (at -40~-20°C)

14 Remote sensing function provided to compensate for voltage drops in output lines

15 Output voltage adjustable via external resistor (range:3.0~5.5V)

使用场景 APPLICATIONS

1 Telecommunication equipment: Base stations, network routers, switches, optical communication devices

2 Industrial automation systems: PLCs (Programmable Logic Controllers), DCS (Distributed Control Systems), servo drives, industrial PCs

3 Test and measurement instruments: Oscilloscopes, signal generators, power analyzers

4 Railway and transportation electronics: On-board control systems, signaling devices (supports wide temperature range -40~+100°C)

5 Renewable energy systems: Auxiliary power supplies for solar inverters, wind turbine control units

6 Embedded systems: High-performance computing modules, embedded controllers

注意事项 PRECAUTIONS

1 Use conduction cooling method (e.g., attach heat sink to aluminum base plate); follow derating curves based on aluminum base plate temperature to ensure normal operation

2 When mounting multiple modules side by side, leave sufficient space for ventilation to keep each module's base plate temperature within specified range

3 Do not route DC input/output patterns under the module to reduce conducted/output noise; place patterns away from the module

4 To shield high-frequency radiated noise, leave a copper pattern on the PCB (acting as shield) and connect it to the CASE pin (for CBS50/100/200 models) or mounting hole

5 Avoid applying excessive stress to input/output pins (exceeding specified limits may damage internal connections)

6 Follow soldering guidelines: Flow soldering at ≤260°C for ≤15 seconds; 26W soldering iron at ≤450°C for ≤5 seconds

7 Operation in hatched areas of derating curves will cause increased ripple and noise; contact manufacturer for detailed cooling advice

8 Minimize temperature fluctuation range to reduce thermal fatigue life impact from power cycles

9 Read official instruction manual and "Before using our product" document (via provided links) before operation

10 When using the "-T" option (mounting hole), ensure heat sink's M3 tap is properly affixed; for applicable models, connect mounting holes to grounding capacitors as required

CBS1002405-RT-PDF数据手册-参考资料