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商品参数
参数完善中
商品详情
产品特点 FEATURES
1
Compact half-brick size (standard for telecommunication market)
2
High efficiency (87% typical for CBS2002412 model at rated input/output)
3
High density design, lightweight (max 83g)
4
High reliability: no built-in aluminum or tantalum electrolytic capacitors
5
Built-in protection circuits: overcurrent (auto recovery over 105% rating), overvoltage (13.8-16.8V for 12V output), thermal protection
6
Built-in remote ON/OFF (negative logic: L=ON, H=OFF) and remote sensing function
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Equipped with M3 tapped mounting holes for easy installation
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Compliance with multiple regulations: CE marking, Low Voltage Directive, RoHS Directive, UKCA marking, Electrical Equipment Safety Regulations, RoHS Regulations
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Safety agency approvals: UL60950-1, C-UL recognized, TuV approved
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Wide operating temperature range: -40°C to +100°C (aluminum base plate)
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Vibration resistance:10-55Hz,5G (60min per X/Y/Z axis) and impact resistance:20G (11ms per axis)
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Isolated DC-DC conversion, low profile design
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5-year warranty for reliable long-term use
14
Conduction cooling method (heat dissipation via aluminum base plate to attached heat sink)
15
Specific electrical specs for CBS2002412: input DC18-36V, output12V/16.7A (max200.4W), line regulation ≤24mV max, load regulation ≤24mV max, ripple ≤120mVp-p (-20 to +100°C)
使用场景 APPLICATIONS
1
Telecommunication equipment: base stations, optical transceivers, network routers/switches
2
Industrial automation: PLCs (Programmable Logic Controllers), DCS (Distributed Control Systems), servo drives, industrial sensors
3
Test and measurement instruments: oscilloscopes, signal generators, power analyzers
4
Railway and transportation systems: on-board electronic devices, signal control systems
5
Medical devices: diagnostic equipment (compliant with safety regulations)
6
Renewable energy systems: solar inverters, battery management systems (BMS)
7
Industrial control panels and embedded systems
8
Telecom infrastructure and data centers
注意事项 PRECAUTIONS
1
Cooling: Use conduction cooling (attach heat sink to aluminum base plate; follow derating curves based on base plate temperature to avoid overheating)
2
Mounting:
3
Leave sufficient ventilation space when using multiple modules side by side to keep base plate temp within limits
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Keep input/output patterns away from the module to reduce conducted/radiated noise
5
Use copper shield pattern on PCB connected to CASE pin or mounting hole to minimize high-frequency noise
6
For modules with "-T" option, use M3 tap on heat sink; for CBS350/450 models, connect mounting hole to grounding capacitor CY
7
Pin handling: Do not apply excessive stress to input/output pins (exceeds specified limits may damage internal connections; avoid bending/pulling leads)
8
Soldering: Follow recommended temps: flow soldering (260°C max for15s), soldering iron (26W:450°C max for5s)
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Thermal management: Reduce temperature fluctuation range to extend thermal fatigue life (critical for frequent temp changes)
10
Avoid operation in hatched areas of derating curves (may cause high ripple/noise levels)
11
Read official instruction manual and safety guidelines before use
CBS2002412-F6
价格：￥1056.03
购买数量
个
(1个/盒，最小起订量1个，递增量：1)
总价金额：
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